先进复合材料用环氧树脂的固化反应和化学流变

CURE KINETICS AND CHEMORHEOLOGICAL BEHAVIOR OF EPOXY RESIN USED IN ADVANCED COMPOSITES

用等温差示扫描量热法(DSC)研究了HD03环氧树脂在一定温度范围内的固化反应。试验结果表明,该环氧树脂体系的固化动力学符合自催化固化反应模型。由试验确定了模型中的动力学参数。发现在树脂的固化后期,固化反应由化学反应控制转变为扩散控制。用以绝对反应速率理论为基础的化学粘度分析模型研究了较高温度范围内HD03环氧树脂的等温粘度和变温的动态粘度变化。用MCR300流变仪测量并计算了HD03环氧树脂的等温粘度和动态粘度。理论预测与试验结果相吻合。

The cure kinetic of HD03 epoxy resin system was analyzed using isothermal DSC. A series of isothermal DSC curves provided information about the kinetics of cure in the limited temperatures. From the experimental data, it was found that the autocatalytic cure kinetic modeling correctly represented the cure kinetics of this system. All kinetic parameters of this epoxy resin system were calculated. In the latter cure stage, the cure reaction shifted from chemical reaction controlled to diffusion controlled. A defined numerical chemoviscosity model of epoxy resin, which was based on the absolute reaction rate theory, was given. Isothermal chemoviscosity of HD03 epoxy resin at some high temperatures and dynamic chemoviscosity at variant heating rate were measured by MCR 300 rheometer. The experimental data were analyzed and calculated. The model predicted results were compared with the experimental measurements, and it was found that the model predictions agreed well with the experimental observations.