摘要
研究了硅微粉的表面处理工艺、粒度分布、体系的粘度和凝胶时间等条件对硅微粉在环氧树脂体系中的沉降率的影响,通过加入少量气相二氧化硅能显著减小硅微粉的沉降率。
The effects of the surface procession and the particle size distributionof silica filler,the viscosity and geltime of epoxy on silica filler sedimentation in epoxy were studied.Adding a little silica white can decrease silica filler sedimentation in epoxy.
出处
《绝缘材料》
CAS
北大核心
2004年第5期25-27,共3页
Insulating Materials