摘要
在26篇文献的基础上综述了改性双马来酰亚胺(BMI)树脂在印制电路板(PCB)中的应用。介绍了二元胺、烯丙基苯基化合物及氰酸酯对BMI进行改性的3种体系,优良的耐热性和粘结性好、低介电常数等,使改性双马来酰亚胺树脂在印制电路板中获得广泛应用。
Bismaleimide resin modified by diamines,allyl compounds and cyanate esters were reˉviewed.The modified bismaleimide resin possessed many good properties,such as good heat reˉsistance,high adhesive strength,low dielectric constant.The related research progress of modiˉfied bismaleimide resin used for PCB was also introduced.
出处
《绝缘材料》
CAS
北大核心
2004年第5期51-54,共4页
Insulating Materials
关键词
双马来酰亚胺树脂
改性
应用
印刷电路板
bismaleimide resin
modification
application
printed circuit board
