摘要
概述了具有盲导通孔的积层板化学镀Cu工艺,可以在盲导通孔内部形成均一厚度的化学镀Cu层,适用于制造高厚径比和高可靠性的积层板。
This paper summarizes electroless copper plating process for build-up board having blind via hole.Equal thick electroless copper plating layer can be formed.It's suitable to manufacturing high aspect ratio and reliability build-up board.
出处
《表面技术》
EI
CAS
CSCD
北大核心
2004年第4期65-66,共2页
Surface Technology
关键词
积层板
盲导通孔
化学镀Cu层
厚径比
Build-up board
Blind via hole
Electroless copper plating
Cu layer
Aspect ratio
