摘要
通过不同工艺的拉晶实验,发现晶转、拉速、热对流等因素对高阻n〈111〉硅单晶径向电阻率均匀性有所影响。采用水平磁场拉晶工艺,通过提高晶转、增大拉速、减小热对流等,可有效提高硅单晶径向电阻率均匀性。
With experiments of high resistance n〈111〉 Si crystal grouth ,we found that theseed rotation rate ,lift rate and thermal convection could affect the uniformity of radial resistivity inn〈111〉Silicon crystal .By increasing seed rotation rate,lift rate and decreasing thermal convec-tion with magnetic field were beneficial to the uniformity of the radial resistivity .
出处
《半导体技术》
CAS
CSCD
北大核心
2004年第9期74-76,共3页
Semiconductor Technology