非晶新型代银钎料的制备及性能研究

Preparation of new amorphous substitute for silver solder and investigation of its properties

采用液态单辊急冷法,在大气下制备了几种非晶态新型代银钎料箔带,其材料的最佳成分数w(Cu)为68%～79%,w(Ni)为5%～14%,w(Sn)为4%～10%,w(P)为7%.在反复实验的基础上,确定了合理的钎料母合金熔炼工艺和单辊急冷法制备工艺,冷辊转速、喷嘴口尺寸、喷带的间隙和喷射压力是制备非晶态箔带的关键工艺参数.制得的几种非晶态新型代银钎料箔带成型性良好,对折180°不折断.并利用DTA,SEM及XRD等方法对Cu P非晶态钎料箔带的非晶形成能力及熔化特性进行了研究.结果表明,制备的Cu Ni Sn P非晶合金箔带熔点和润湿性与Ag基钎料接近.

Several kinds of new amorphous ribbons substitutes for silver solder are prepared by means of rapid solidification,single roller,and liquid melt under atmospheric condition.Its optimal chemical constitution is such as 68% ～79%Cu,5% ～14%Ni,4% ～10%Sn and 7%P.On the basis of repeated experiments,the smelting and quenching process of filler alloys,as well as the preparation process of single roller and rapid solidification are determined.It is found that the key processing parameters for amorphous ribbon preparation are roller surface velocity,nozzle sizes,clearance between nozzle and roller,and spraying pressure.Some kinds of well-formed amorphous ribbons would not be broken if folded overlappedly.Glass formation ability and melting feature of Cu-P alloy ribbon are studied with DTA,SEM,and XRD methods,respectively.It is shown that melting point and wetting ability of amorphous Cu-Ni-Sn-P alloy ribbons are almost the same as or better than those of silver-base filler metals.