摘要
旋转圆盘电极动电位扫描 (RRDE)、交流阻抗 (EIS)、原子力显微镜 (AFM )等方法研究氯离子与添加剂AQ对酸性镀铜电沉积过程的影响 ,从沉积机理的角度解释氯离子必不可少的原因。结果表明 ,加入的氯离子改变了吸附络合物的放电形式 ,表现在氯离子通过离子桥机理形成三维网状结构的 [Cl…AQCu(I)…Cl]放电以阻碍整个放电过程 ,增加反应电阻 。
The effects of chloride ions and organic additive AQ on acid copper electrodeposition are investigated by means of RRDE, EIS and AFM. The reason why chloride ions are indispensable to acid copper electroplating is interpreted from electrodeposition mechanism. The results show that the added chloride ions have changed the discharge form of the adsorbed complex compounds, manifesting themselves as a discharge of [Cl...AQCu(I)...Cl] of 3-dimension web-like structure formed by chloride ions through ion bridge mechanism to hinder the entire discharge process and increase reaction resistance, thus obtaining a coating with good properties.
出处
《电镀与环保》
CAS
CSCD
2004年第5期7-9,共3页
Electroplating & Pollution Control
