摘要
强度和导电性是金属材料两个至关重要的性能,但往往顾此失彼,不可兼得。本研究提出利用纳米尺寸孪晶实现金属强化,以期获得高强度和高导电性。实验采用脉冲电解沉积技术制备出具有高密度纳米尺寸孪晶的纯铜薄膜,其拉伸强度达1068MPa,是普通纯铜的10倍以上,并且室温电导率与无氧高导铜相当(97%IACS)。系统研究了孪晶片层厚度对样品性能的影响。
Methods used to strengthen metals generally cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength of 1068 MPa, which is about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper(97%IACS). The effect of twin lamella thickness on the samples properties was studied systematically.
出处
《中国科学院院刊》
2004年第5期352-354,共3页
Bulletin of Chinese Academy of Sciences
基金
国家自然科学基金资助项目
