Sn-Zn-Bi-Ag系钎料物理性能研究

Study on Physical Properties of Sn-Zn-Bi-Ag Solder System

通过成分设计形成了Sn-Zn-Bi-Ag系钎料合金。针对微电子产业的应用要求研究了钎料的物理性能，分析了Sn-Zn-Bi-Ag系钎料中合金元素对钎料物理性能的影响。发现：Sn-Zn-Bi-Ag系钎料的合金元素中Bi、Ag含量(质量分数)的增加会使钎料的密度增大，而Zn含量对钎料的密度影响不大。Zn含量5．0％～6．5％，Bi含量1．5％～3．0％，A2含量0．5％～0.8％范围的Sn-Zn-Bi-Ag钎料具有较好的润湿性能。Sn-Zn-Bi-Ag系钎料中Bi含量不高时，钎料的电阻率均比传统Sn-37Pb钎料小。随着Bi含量的增加，钎料的电阻率有明显增大的趋势。

The Sn-Zn-Bi-Ag solder system was developed by ingredient design. The physical properties of the designed solders were researched according to the industrial application requirements. The effects of alloy elements on physical properties of the designed solders were analysed. It was found that an content increase of Bi or Ag leaded to an increase of the solders density, while an content increase of Zn affected the solders density slightly. The Sn-Zn-Bi-Ag alloys with the content ranges of Zn 5.0wt%~6.5wt%, Bi 1.5wt%~3.0wt%, and Ag 0.5wt%~0.8wt% had relatively good wetting properties. The risistivities of all the Sn-Zn-Bi-Ag alloys with low Bi content were smaller than that of traditional Sn-37Pb solder. Along with the increase of Bi content, an obvious increscent current of the risistivities of the Sn-Zn-Bi-Ag alloys was observed.