摘要
电子制造过程无铅化已是大势所趋。但目前研发的无铅焊料也存在一些问题:如所添加的合金元素也会污染环境并危害人体健康;大部分添加的合金元素储量有限;无铅焊料生产加工所消耗的能量大大高于锡铅焊料等。指出研发新的绿色互连技术、采取有效的废弃物回收再利用措施才能从根本上解决电子产品废弃物对环境影响的问题。
Application of lead-free solders is main trend in the electronic industry. But, there are some problems in the lead-free solders. For example, the alloys in lead-free solders also bring the hazardous effects to the public health and contaminate environment; the amount of elements in lead-free solders is very limited and the required energy in the lead-free solders production greatly exceed it required in the lead solders. Finally the essential approach to eliminate the impacts of the waste from electrical and electronic equipment (WEEE) on the environment is to develop new green interconnect technology and take efficient measures to reuse WEEE.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第11期71-74,共4页
Electronic Components And Materials
基金
863资助项目(2002AA404110)
中港基金项目资助(60318002)
关键词
金属材料
无铅焊料
锡铅焊料
金属毒性
环境污染
metal materials
lead-free solders
SnPb solders
metal toxicity
environment pollution
