摘要
从电子产品整机厂商的角度,描述了如何保证无铅元器件的可靠性。由于主流无铅锡膏合金为锡银铜系列,其合金的熔点从传统锡铅共晶(锡37%铅)的183℃上升到217℃,随着焊接温度的提高,要求元器件能承受的温度增高,且合金成分也与有铅不同。必须通过对无铅元器件进行相关认证以及可靠性试验验证,如:外观包装要求、元器件耐热要求、可焊性要求、引脚镀层要求、以及相关可靠性试验等方面,以保证从有铅到无铅的成功转换、进而保证产品的长期使用的稳定性和可靠性。
Several critical topics to the qualification of lead-free components were described. Sn-Ag-Cu alloy of solder paste was recommended by electronics assembly industry. The melt point of above-mentioned alloy is 217℃, it means that the higher temperature is required for lead-free assembly. The component is the most important factor impacting lead-free process conversion. And the quality of lead-free components,including packaging requirement, peak temperature, solderability, requirement of component leads and terminations, assembly reliability test of component,etc, should be qualified. A qualification criterion of lead-free components shall be established for reliability of productions in your company.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2004年第11期79-82,共4页
Electronic Components And Materials
关键词
电子技术
无铅
可靠性
元器件
认证
electronic technology
lead-free
reliability
component
qualification
