摘要
介绍了一种用硅–硅键合MEMS技术制作的高温电容式压力传感器,并给出了详细的制作工艺。文中对测试装置、测试电路进行了介绍和深入分析,最后用此测试电路对制作的传感器器件进行了高温测试,测试结果表明这种微传感器可在低于350℃的条件下正常工作,且具有很大的线性工作范围、良好的稳定性和较高的灵敏度,其应用前景十分广阔。
MEMS high temperature capacitive pressure micro-sensor that combines a touch-modestructure and the silicon-silicon fusion bonding technique are mainly introduced. The producingtechnology is given in details. The testing equipment and testing circuit are introduced and ana-lyzed in details. At last, some testing experiments are done for the produced high temperature ca-pacitive pressure micro-sensors. The results proved that this type of micro-sensor can work wellunder 350℃, and has excellent linearity, relatively good stability and relatively high sensitivity; ithas lots of application fields.
出处
《半导体技术》
CAS
CSCD
北大核心
2004年第11期8-11,共4页
Semiconductor Technology
