摘要
讲述了工序能力指数(CPK)评价的用途,可靠性试验中使用CPK所能起到的作用,提出了进行该评价的具体实施步骤。对于在热冲击试验前后的键合拉力进行了工序能力指数评价,并对试验结果进行了分析,得出了结论。
The use of the procedure ability estimation and operation for Cpk in fail-tests aredescribed. The implementary steps for Cpk are put forward. The working procedure ability forwirebonding force before thermal shock test and after thermal shock test were estimated. The resultin test are analyzed,and a conclusion is given.
出处
《半导体技术》
CAS
CSCD
北大核心
2004年第11期29-31,48,共4页
Semiconductor Technology
