摘要
对激光刻蚀过程中的气化现象进行了热力学分析,根据不同的材质合理地选取工作条件,进行了激光狭缝刻制、太阳电池硅片打孔及激光标识的试验,并对刻蚀结果进行了对比分析,得出与理论分析相符的结果。
The gasifying phenomenon in laser etching is analyzed with the theory of heat conduction. According to different materials, appropriate working condition is selected, experiments of engraving, broaching and marking by using high-power laser are operated, and the etching results are compared. The results show that the method is consistent with the theory analysis and can be applied in many fields.
出处
《红外与激光工程》
EI
CSCD
北大核心
2004年第5期469-472,共4页
Infrared and Laser Engineering
关键词
激光刻蚀
激光标识
光学狭缝
硅片
Gasification
Heat conduction
High power lasers
Laser applications
Silicon wafers