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用有机聚合物连接碳化硅陶瓷及陶瓷基复合材料 被引量:16

JOINING OF SiC AND SiC-BASED COMPOSITES USING PRECERAMIC POLYMERS
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摘要 用陶瓷先驱体有机聚合物连接陶瓷及陶瓷基复合材料是一种成本低廉、工艺新颖、可满足特殊高温条件下连接件要求的新型连接技术。介绍了近年来采用先驱体有机聚合物连接SiC及其复合材料的研究现状,重点对影响连接强度的因素进行分析,并提出相应的改进措施。由于该技术具有连接温度较低、连接过程简单、接头热应力小,连接件的热稳定性高等特点,因此它是陶瓷及其复合材料最有前途的连接方法之一。 Joining of ceramics and ceramic matrix composites (CMCs) by using preceramic polymers is a novel technique with lower cost and higher joining strength. It can meet the special joining requirements at high temperatures. The progress of processes to join SiC ceramic and to join SiC-based composites using preceramic polymers was introduced. Effects of technological parameters on joining strength were described, and methods to improve joining strength were proposed. The processes have promising prospect due to advantages, such as low joining temperature, low residual thermal stress of joints, good thermal stability of joints, and the possibility to design the composition and structure of the welding seam.
出处 《硅酸盐学报》 EI CAS CSCD 北大核心 2004年第10期1246-1251,共6页 Journal of The Chinese Ceramic Society
基金 国家自然科学基金(50271003) 中国航空基础科学基金(03H51024)资助项目。
关键词 陶瓷连接 碳化硅 碳化硅基复合材料 陶瓷先驱体有机聚合物 综述 Adhesive joints Ceramic matrix composites Polymers Thermal stress
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参考文献14

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