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Adobe实现InDesign中文化 被引量:1

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作者 陈宏林
出处 《微电脑世界》 2004年第11期55-55,共1页 PC World China
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  • 1Petroski J.Thermal challenges facing new generation light emitting diodes(LEDs) for lighting applications[J].Proc.SPIE,2002,4 776:215-222.
  • 2Tuckerman D B,Pease R F W.High performance heat sinking for VLSI[J].IEEE Electron Device Lett.,1981,2:126-129.
  • 3Skandakumaran P,Ortega A,Jamal-Eddine T,et al.Multi-layered SiC microchannel heat sinks-modeling and experiment[A].2004 Inter Society Conference on Thermal Phenomena[C].2004.352-360.
  • 4Missaggia L J,Walpole J N.A microchannel heat sink with alternating directions of water flow in adjacent channels[J].Proc.SPIE,1991,1 582:106-111.
  • 5Dang B,Bakir M S,Meindl J D.Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink[J].IEEE Electron Device Lett.,2006,27(2):117-119.
  • 6Kishimoto T,Sasaki S.Cooling characteristics of diamond-shaped interrupted cooling fins for high power LSI devices[J].Electron.Lett.,1987,23(9):456-457.
  • 7Goodling J S.Microchannel heat exchangers:A review[J].Proc.SPIE,1997,66(1993):66-82.
  • 8Colgan E G,Furman B,Gaynes M,et al,A practical implementation of silicon microchannel coolers for high power chips[A].21st IEEE SEMI-THERM Symposium[C].2005.1-7.
  • 9Kishimoto T,Ohsaki T.VLSI packaging technique using liquid-cooled channels[J].IEEE Trans.Components,Hybrids,and Manufacturing Technol.,1986,9(4):328-335.
  • 10Mundinger,David C.Modular package for cooling a laser diode array[P].United States:5105429,1992.

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