期刊文献+

Effects of Electric Contact Failure on Signal Transmission in the Lossy Circuits

Effects of Electric Contact Failure on Signal Transmission in the Lossy Circuits
原文传递
导出
摘要 Based on the former research results of the influence of contact failure in ideal and unmatched circuits, this paper further studies theoretically the effects of contact failure on the digital signal transmission in the lossy circuits, which may happen widely in practical applications. Experiences show that even in high-quality lines, losses deform the voltage and current wave shapes owing to their effects on the amplitude of the various waves making up the over-all line voltage and current. Although the derivations show that the effects of contact failure in the lossy circuits on the signal transmission are quite complicated. The probability of occurrence of error codes can be increased significantly.
出处 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2004年第2期50-54,共5页 中国邮电高校学报(英文版)
关键词 contact failure lossy circuits signal transmission contact failure lossy circuits signal transmission
  • 相关文献

参考文献15

  • 1[1]REAGOR B T, RUSSEL C A. A survey of Manufacturing Problems in Telecommunications Equipment[A]. Proceedings of IC-ECEMA[C], 1986.
  • 2[2]RAGNAR HOLM. Electric contacts[M]. Berlin(Germany): Springer-Verlag,1967.1-4.
  • 3[3]KULWANOSKI G, GAYNES M,SMITH A, et al. Electrical contact failure mechanisms relevant to electronic packages[A]. Proceedings of the Thirty-Seventh IEEE Holm Conference on Electrical Contacts[C], 1991.
  • 4[4]ROBERT S.Mroczkowski, JAMES M. Maynard. Estimating connector reliability[A]. IEEE Trans. On Raliability[C], 1991.
  • 5[5]REAGOR B T, RUSSEL C A. A survey of problem in telecommunication equipment resulting from.chemical contamination[A]. Proceedings of the Thirty-First IEEE Holm Conference on Electrical Contacts[C], 1985.
  • 6[6]ANTLER M, DRODOWICZ M H. Wear of gold electrodeposits: effect of substrate and nickel underplate[J]. Bell System Technical Journal, 1979, 58(2):323-349.
  • 7[7]MORTON A, MICHAEL H D, HAQUE C A. connector contact materials: effect of environment on clad palladium, palladium-silver alloys and gold electrodeposits[J]. IEEE Trans. On Components,1981,4(4):482-490.
  • 8LUO Guo ping directed by ZHANG Ji gao.An Analysis and Simulation of Failure in Dower Connectors[J].The Journal of China Universities of Posts and Telecommunications,2002,9(3):79-80. 被引量:1
  • 9[9]SUN Bai-sheng, ZHANG Ji-gao, LIANG J G, et al. Preliminary investigation on error code rate of high speed digital circuitry caused by electric contact failure[A]. Proceedings of the Forty-Fifth IEEE Holm Conference on Electrical Contacts[C]. Piscataway(NJ): IEEE,1999.
  • 10[10]SUN Bai-sheng. Effects of electric contact failure on signal transmission in unmatched circuits[A]. Proceedings of the Forty-Seventh IEEE Holm Conference on Electrical Contacts[C]. Piscataway(NJ): IEEE, 2001.186-191.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部