摘要
采用改性熔炼工艺制备了Sn-0.7Cu改性合金,用润湿平衡法研究了温度、钎剂中卤素含量、浸渍时间对铜引线材料润湿性的影响,并与Sn-37Pb进行了对比。结果表明:升高温度可明显提高润湿性;当用R(非活性)钎剂时,Sn-0.7Cu对铜引线不润湿;随着钎剂中卤素离子的增加,其润湿性得到显著改善,钎剂中卤素含量以≥0.4wt％为宜;随浸渍时间的延长,润湿力明显降低,表明界面存在“失润现象”。
The Sn-0. 7Cu alloy was prepared by a special melting technique. Several effect factors on wetting, i.e. temperature of soldering, Cl^-content in flux,wetting time etc.,is studied by wetting balance method and compared with the results of Sn-37Pb. The results indicate that the rise of the temperature can remarkably improve the wettability of Sn-0. 7Cu on the face of copper. Sn-0. 7Cu alloy can not wet copper with R type flux. With an increase of Cl^-content in flux, the wettability of Sn-0. 7Cu remarkably improves and the best Cl^-content is more than 0. 4wt%. Wetting force fall with the delay of time, indicate there is'lose-wetting phenomena'in the interface of solder and copper.
出处
《材料导报》
EI
CAS
CSCD
2004年第9期99-101,共3页
Materials Reports
基金
重庆市科委计划资助项目(渝科计字[2003]24)
