摘要
阐述了网版印刷印料无铅化的必要性和可行性,介绍了无铅印料的现状和发展。提出了无铅印料的配方及性能要求,说明了无铅印料在倒装芯片与表面贴装中的应用。
This article specifies the necessity and feasibilityfor using screen printing paste free of lead. It lines out the stateof art of lead-free printing paste and the progress in applications.The formulation and performance of printing paste free of lead areintroduced. It also introduces the lead-free printing paste appli-cable to SMT.
出处
《丝网印刷》
2004年第9期31-37,共7页
Screen Printing