摘要
对铜在酸性CuCl_2溶液中蚀刻反应机理论述,利用氧化-还原电动势原理,详细论述了Ni80Cr20合金在酸性CuCl_2溶液中化学蚀刻反应机理,以及影响蚀刻速度的因素,并对溶液中金属离子的存在形式作了验证。
The paper describes reaction mechanism of copper in acid CuCl_2 solution. Making use of the fundamental of oxido-reducing electro-motive force (EMF). Detailed describes chemical-etching reaction mechanism of NiCr alloy in acid CuCl_2 solution and factors of influencing etching speed. Verifies the existing form of metal ion in acid CuCl_2 solution.
出处
《印制电路信息》
2004年第8期26-29,共4页
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