用陶瓷厚膜埋入无源元件进行设计:填补两大空白

Designing with Ceramic Thick-film Embedded Passives: Bridging the Gaps

埋入无源元件(即被精确制入PCB基板的电阻器和电容器)将是PCB工业下一项关键性技术。但是,PCB制造厂商和设计人员首先必须填补设计与元件制造之间的空白,必须填补设计与可用CAD工具之间的空白。

Embedded passives (i.e., resistors and capacitors built right into the PCB substrate) will be the next pirotal technology for the PCB industry. But PCB manufactruers and designers must first bridge the gaps between the design and part manufacturing, and between the design and available CAD tools.