摘要
研究了Cu含量对机械合金化纳米晶W_xCu(x=15,20,25)复合粉末烧结行为的影响 ,并考察了一种新型晶粒长大抑制剂对抑制W晶粒长大的作用 ,探讨了其作用机理。结果表明 ,Cu含量增加有利于烧结致密化 ,并减弱聚晶长大的趋势。纳米晶W_Cu粉末在1200～1250℃烧结30min后 ,致密度为97 %～98%,对应的晶粒度约为300～500nm ,其中1200℃烧结30min对应的晶粒尺寸约为300～350nm ,明显低于国外1μm的晶粒度水平 ,新型晶粒长大抑制剂有望对W晶粒长大有明显的抑制效果。
Effect of Cu content on sintering behavior of nanograined W_xCu(x=15,20,25)composite powder produced by mechanical alloying was studied,and the influence of a new grain growth inhibitor on W grain growth as well as its effecting mechanism was also investigated.The results show that the increasing Cu content is beneficial to improving density,depressing the trend of congregating grain growth.The relative density of97%～98%and the grain size of300～500nm can be achieved after sintering at1200～1250℃for30min.Particularly,the grain size of merely about300～350nm is in correspondence with the sintering temperature of1200℃,which is much lower than the value of1μm managed by foreign researchers,so the grain growth inhibitor in this experiment is expected to be much effective.
出处
《电工材料》
CAS
2004年第3期10-14,共5页
Electrical Engineering Materials
