摘要
文章介绍了光电耦合器结构及其CTR参数,分析红外发光芯片和光敏接收芯片对光耦CTR值影响,重点讨论了工艺上内点胶操作与CTR的关系,提出了内点胶操作所形成光学通道的椭圆模型理论和各种点胶方式,并用实验进行验证和说明。最后总结出在生产过程中控制CTR值的芯片配对方案和工艺操作方法。
The structure and CTR parameter of photo coupler were illustrated. The influences factor of infrared LED chips and phototransistor chips on CTR, were analyzed. Based on the long period's practice, a new dispensing ellipsoid theory model and all sorts of control methods which formed optic channel in photo coupler were given.
出处
《光电子技术与信息》
2004年第5期21-25,共5页
Optoelectronic Technology & Information
关键词
光耦
CTR
工艺
芯片
点胶
photo coupler
current transfer ratio(CTR)
technique
chip
dispensing
