TiN颗粒增强铜基复合材料的制备及性能研究

Fabrication and Properties of TiN Particle-Reinforced Copper Matrix Composites

采用粉末冶金法制备了不同颗粒含量的TiNp/Cu系列复合材料。研究了TiNp 对TiNp/Cu复合材料的硬度、屈服强度、导电性能及摩擦磨损性能的影响 ,并与相同制备工艺所制备的纯铜及WCp/Cu复合材料的性能作了比较。针对粉末冶金法制备的复合材料 ,对已有的电导率理论计算模型进行了修正。结果表明 :TiNp/Cu复合材料的硬度、屈服强度、摩擦磨损性能明显优于纯铜 ,导电性能与相同体积分数的WCp/Cu复合材料相近 ,而摩擦磨损性能优于相同体积分数的WCp/Cu复合材料 ,TiNp/Cu是一种具有良好应用前景的新型功能材料。

TiN p/Cu composites with different particle contents were fabricated by powder metallurgy. The effect of TiN p on the hardness, yield strength, electrical conductivity and wear properties of TiN p/Cu composites were studied. Pure copper and WC p/Cu composites were fabricated by same fabrication processing to compare with the properties of TiN p/Cu composites. The present theoretical models for predicting the electrical resistivity of composites were modified for the composites fabricated by powder metallurgy. As a results, the hardness, yield strength and wear-resistance of TiN p/Cu composites are much better than the pure copper. TiN p/Cu composites and WC p/Cu composites with same particle volume fractions have near electrical conductivities. TiN p/Cu composites exhibit better wear-resistance than the WC p/Cu composites. TiN p/Cu composite is a new functional materials with great application potential.