铜填充导电涂料的研究

Studies of the Conductive Coating Filled by Copper

本文研究了以醇酸树脂为基料、铜粉为填料的导电涂料中填料浓度与漆膜电阻率的关系.实验表明,油酸、有机钛酸脂添加剂有提高铜系涂料导电稳定性的作用,可望制得导电性能和导电稳定性满足电磁屏蔽要求的漆膜.

The matrix was alkyd resin, the filler was copper powder. The matrix and filler were mixed using physical method. The R, of the coating film depends on content of filler, the R, will decreases with the content from 50% to 91% (by weight). In order to resolve the problem that the copper powder will be oxidated during application. We treated the copper coating with iso-propyl trioleogl titanate and oleinic acid. In this method, the Rs of coating is stable for a longer period of time, and the conductive coating shows good efficiency of shielding EMI.