摘要
多层印制板的制作是一个生产工序复杂且周期很长的过程,那么造成金属化孔镀层空洞的原因也就很复杂。这里本人通过试验,分析了针对我们的生产工艺路线及设备配置运行情况出现的金属化孔镀层空洞的主要产生原因,从产生原因的工序出发,提出了如何优化工艺参数,进行严格的工艺及质量控制,以保证孔金属化的质量。
Making Multilayer printed board has a complex working procedure and long period, then the reason of causing Void PTH is very complex. Analyze what cause the void PTH in our working procedure and equipments on the basis of our test. In order to ensure the quality of the PTH, it gives the methods of optimizing the process parameter and strictly managing the process and quality control of the multiplayer printed board.
出处
《电子工艺技术》
2004年第6期258-260,共3页
Electronics Process Technology
