固态继电器的热分析

Thermal Analysis of Solid State Relay

固态继电器是一种无触头电器,其特点是反应速度快、可靠性高、寿命长, 被广泛应用于航空、航天、军工等领域。由于固态继电器本身的特点,产品的过载能力 一直是制约该类产品进行设计和使用的重要问题,尤其是固态继电器向着小型化的趋 势发展时,其热分析显得特别重要。本文介绍了使用有限元方法对固态继电器的三维 热分析。由结果分析可知,对层状模型的简化可以用于热分析。

Solid state relay (SSR), because of no contact, quick speed, well reliability and longevity of ser- vice , has been widely used in many fields, such as aviation, space, war industry. Because of the attributes of SSR itself, the thermal analysis of it has been being a problem restricting the design and use of this type of product, particularly when it comes to the trend that the size of SSR becomes smaller and smaller, this problem seems to be more important. The thermal analysis of solid state relay was illustrated by the method of finite element analysis . The results of the analysis show that the simplification of the sandwich can be used in the thermal analysis.