摘要
概述了关于无铅电子焊料全球范围的立法与研发计划、国内外无铅焊料的发展现状及所取得的研究成果,探讨了无铅焊料合金的专利问题,进行了无铅软钎焊技术可行性、经济性和可靠性分析,介绍了无铅焊料的应用情况,并展望了前景。
The global legal regulations on leaded solder and research and development programs on lead-freesolder around the world are briefly introduced.The progress and main achievements of lead-free solder are re-viewed.The patent problem on lead-free solder materials,the feasibility,economic aspect,and reliability of lead-freesoldering technology are analysed.The current status and future prospects of application of lead-free soldering are pre-sented.
出处
《材料导报》
EI
CAS
CSCD
2004年第6期72-75,共4页
Materials Reports
基金
国家"十五"863计划支持项目(2002AA322040)
关键词
无铅焊料
微电子组装
焊接
环境保护
软钎焊材料
lead-free solder
microeleetronic assembly technology
soldering
application
