电子封装材料的研究现状及进展

Present Status and Progress in Study of Electronic Packaging Materials

根据电子及封装技术的快速发展特点,通过比较几种传统的电子封装材料的优劣,以金属基复合材料为重点,阐述了三明治复合板 KCK(Kovar/Cu/Kovar)的制作及性能,并展望了电子封装材料的发展方向及前景。

According to the characteristics of the rapid development of electronic packaging technology,andby comparing the merits and shortcomings of several traditional electronic packaging materials,this article lays stresson matal matrix composite.Further more,it reviews the manufacture and properties of sandwich sheet——KCK(Ko-var/Cu/Kovar),and predicts the developing trends of electronic packaging materials.