摘要
高密度封装技术的飞速发展也给测试技术提出了新挑战。为了应对挑战,新的测试技术不断涌现。本文主要介绍了几种新型测试技术的特点,并对未来测试技术的发展趋势及方向进行了初步分析。
The rapid development of high density packaging technology has already bring up the new challenge to testing technology. For replying challenge, the new testing technology continuously appears. Characteristics of several advanced testing technology are introduced in the paper. The up-to-date trends are discussed and the future research directions are suggested.
出处
《印制电路信息》
2004年第9期64-66,共3页
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