合金胶体点式电蚀剂配方筛选及粘结强度比较

The screening of formula of alloy-colloid spot-electrolytic-etching agent and the comparison of bond strength

为提高口腔内常用合金与粘结材料的粘结强度 ,研究了胶体电解蚀刻剂并优选了不同合金点式电蚀剂的配方。方法 采用正交设计优选各金属点式电蚀剂的最佳配方 ,进行点式电解蚀刻 ,比较其剪切粘结强度 ,同时对点式电解蚀刻后和抗剪强度测试后的金属表面进行扫描电镜观察。结果 四种合金剪切强度以Ni-Cr合金及 18- 8不锈钢最高 ,Cu合金最低。扫描电镜观察均显示出凹凸不平微孔的立体结构 ,剪切后的合金表面微孔内 ,可见大量残留的复合树脂。结论 合金对点式电解蚀刻很敏感 ,可获得较高的粘结强度 ,胶体电解液可用于口腔内操作。

Objective The colloid electrolytic-etching agent and the electrolytic formala for different alloys were studied to improve the bond strength of resin and alloy.Methods The formulas were selected by orthogonal test.According to the selected formulas the alloys were treated in spot electrolytic etching and then the shear bond strengths were compared.The etched metal surfaces and the sheared metal surfaces were observed with SEM.Results The highest bond strength was Ni-Cr alloy,and the lowest was Cu-alloy.The SEM showed that there were a large number of micro aperture in the four etched alloy surfaces.Conclusion The alloys are sensitive to spot electrolytic etching and high bonding strength can be obtained..