摘要
A novel fusion bonding method between silicon and glass with Nd: YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 μm, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.
A novel fusion bonding method between silicon and glass with Nd: YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 μm, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.
基金
This work was supported by Beijing Committee of Education Foundation(No. KM200310005009).
