摘要
介绍采用射线方法检测功率管芯片与基座之间的焊接质量。试验证明,选用合适的透照参数可使X射线照相和X射线实时成像对焊接部位的检测均得到较高的对比灵敏度,但X射线照相法成本低廉,一次可透照多个工件,效率高,为该功率管焊接质量的理想检测方法。
The welding quality between the chip and the base of power transistor inspected by radiographic testing was described. It was shown by experiments that the contrast sensitivities obtained from X-ray radiography and X-ray real-time imaging technique were both very good, but the former one was much cheaper, which could inspect a lot of parts once, and was more effective, so it was the desirable method for welding quality inspection of power transistor.
出处
《无损检测》
2004年第11期580-581,584,共3页
Nondestructive Testing
关键词
X射线照相
X射线实时成像
功率管
焊接质量
Radiography
X-ray real-time imaging
Power transistor
Welding quality