铜基无氰镀银的研究

The Study on Cyanide-free Silver Electroplating on Copper Substrate

实验研究了以海因为络合剂在铜基上无氰镀银的工艺,在研究单因素条件的基础上利用正交实验进一步研究了最佳配方。此配方可大大提高镀液的稳定性,并使镀层光亮细致,同时研究了温度、pH值、络合剂等对镀液性能及镀银层性能的影响。

The process of cyanide-free silver electroplating on copper substrate has been studied.with hydantoin as complex forming agent.Based on the single factor study and orthogonal method,the optimal composition formula is obtained.With the optimal formula,the stability of solution,the brightness and the fineness of plating layer are greatly improved.The influences of temperature,pH value and complex foaming agent on the properties of solution and plating layer are studied.