摘要
The scattering of SH wave by a cylindrical piezoelectric inclusion partially debonded from its surrounding piezoelectric material is investigated using the wave function expansion method and singular integral equation technique. The debonding regions are modeled as mul- tiple arc-shaped interface cracks with non-contacting faces. By expressing the scattered ?elds as wave function expansions with unknown coe?cients, the mixed boundary value problem is ?rstly reduced to a set of simultaneous dual series equations. Then dislocation density functions are introduced as unknowns to transform these dual series equations into Cauchy singular integral equations of the ?rst type, which can be numerically solved easily. The solution is valid for arbi- trary number and size of the debonds. Finally, numerical results of the dynamic stress intensity factors are presented for the cases of one debond and two debonds. The e?ects of incidence direc- tion, crack con?guration and various material parameters on the dynamic stress intensity factors are respectively discussed. The solution of this problem is expected to ?nd applications in the investigation of dynamic fracture properties of piezoelectric materials with cracks.
The scattering of SH wave by a cylindrical piezoelectric inclusion partially debonded from its surrounding piezoelectric material is investigated using the wave function expansion method and singular integral equation technique. The debonding regions are modeled as mul- tiple arc-shaped interface cracks with non-contacting faces. By expressing the scattered ?elds as wave function expansions with unknown coe?cients, the mixed boundary value problem is ?rstly reduced to a set of simultaneous dual series equations. Then dislocation density functions are introduced as unknowns to transform these dual series equations into Cauchy singular integral equations of the ?rst type, which can be numerically solved easily. The solution is valid for arbi- trary number and size of the debonds. Finally, numerical results of the dynamic stress intensity factors are presented for the cases of one debond and two debonds. The e?ects of incidence direc- tion, crack con?guration and various material parameters on the dynamic stress intensity factors are respectively discussed. The solution of this problem is expected to ?nd applications in the investigation of dynamic fracture properties of piezoelectric materials with cracks.
基金
Project supported by the Research Fund for Doctors of Hebei Province
China (No. B2001213).
