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厚膜焊区Au-Pt导体浆料(英文) 被引量:2

Thick-film Au-Pt Conductive Paste Used as Soldered Area
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摘要 用聚乙烯醇作分散剂,抗坏血酸作还原剂,将氯金酸还原到Au;以水合肼作还原剂,将氯铂酸盐还原到Pt,分别制备了Au粉和Pt粉;Au、Pt粉的平均尺寸分别为0.55μm和≈0.08μm。用氧化物和硼硅酸盐作粘结剂配制了1种玻璃粘结、3种混合粘结的浆料。浆料性能测量结果表明,一种性能较好的浆料有:拉伸强度>20N/mm2,烧结后收缩≤0.003mm,片电阻率≤40mΩ/□/25μm,30次浸锡后的溶蚀量为0.062~0.087mm。CuO溶入玻璃改善了化学键,从而提高了附着力。 By using polyvinyl alcohol as disperse agent, Au- and Pt powders were prepared respectively by reduction of chlorauric acid to Au with ascorbic acid and reduction of chloroplatinate to Pt with hydrazine. Average size was 0.55μm for Au- and ≈0.08μm for Pt powder. One glass-, three mixed bonded pastes with Au/Pt ratio of 78/22 were formulated with oxides and borosilicates as binders. The measurement showed that the properties of a better paste were: tensile strength of >20N/mm2, shrinkage after firing of ≤0.003mm, sheet resistivity of ≤40mΩ/□/25μm, and leached amount of 0.062~0.087 mm after dipping 30 times. CuO dissolved into the glass improving chemical bond, consequently, increasing the adhesion.
出处 《贵金属》 CAS CSCD 2004年第4期26-30,共5页 Precious Metals
关键词 硼硅酸盐 水合肼 浆料性能 还原剂 氯铂酸 分散剂 附着力 抗坏血酸 配制 混合 Metal materials Thick-film microelectronic technology Au-Pt conductor Soldered area Binder
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  • 1Yu Shougeng. The application of sintered behavior of gold- and platinum- (or palladium-) powders to thick film microelectronic technology [A]. Proceedings of the 11th International Precious Metals Conference, Brussels[C]. Belgium: IPMI, 1987, 81-91.
  • 2Taylor B E, Getty R R, Henderson J, et al. Air and nitrogen-fireable multilayer systems: materials and performance characteristics [J]. Solid State Tech., 1984, 27(3): 180-185.
  • 3Harper C A. Hand book of Thick Film Microelectronics [M]. New York: McGraw-Hill, 1974.
  • 4Hitch T T, Bube K R. Basic Adhesion Mechanisms in Thick and Thin Films, Final Report [R]. RCA Laboratories,NASC Contract No. N00019-75-C-0145, 1976.

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