摘要
通过对纯铜的机械、电、热和化学性能进行分析和比较,表明铜线在芯片引线键合工艺中具有良好的机械、电、热性能。它替代金线和铝线,可缩小焊接间距、提高芯片频率和可靠性。但是铜由于表面氧化使其可焊性较差,可采用焊接工艺来改善其可焊性,并给出了具体方案。
By the analysis of the mechanics, electricity, heat and oxidation properties, it was indicated that copper wire possesses good properties of mechanics, electricity, and heat in wire bonding of the chips. It is possible to use copper wire for bonding to shorten the space of bonding, and to enhance frequency and reliability of chips. But copper wire has poor weldability because of the oxidation of surface. And so the weldability could be improved by reasonable bonding technique and the practical scheme was given in this article.
出处
《贵金属》
CAS
CSCD
2004年第4期52-57,共6页
Precious Metals
基金
湖南省教育厅科学研究资助项目(03C590)
