摘要
桥连现象是波峰焊接过程中最常见的一种焊接缺陷,其影响因素是多方面的。随着无铅化电子组装的应用,桥连等焊接缺陷产生的几率增大。分析了桥连产生的机理,并通过实验分析了各种参数对产生桥连的影响。
Bridge phenomenon is a frequent defect in wave soldering,which have many affected factors.Probability of bridge phenomenon was augmented in lead-free electronical assembly.In the paper mech-anism of causing bridges were analyzed and many parameters of affecting bridges were assayed through experiments.
出处
《电子工业专用设备》
2004年第11期65-69,共5页
Equipment for Electronic Products Manufacturing
关键词
桥连
波峰焊
润湿力
表面张力
附加内压
Bridge
Wave soldering
Wetting force
Surface tension
Additional inner press
