摘要
本文论述了随着印制线路板(PCB)向高密度互连方向的发展,PCB导通孔急速走向直径0.1mm的微小化,对钻头的要求越来越高,介绍了纳米技术在线路板用微钻中的发展前景和国内外趋势,以及纳米技术提高钻头性能的机理、制备方法。
The trend forwards higher density in PCB requires smaller holes down to 0.1mm diameter to be drilledthrough the board layers. Demand to drill used in PCB is more and more strict. In the paper, development of nano-technology used in micro-drill worldwide is reviewed, the mechanism and preparation of nano-technology to improvingproperties of micro-drill is introduced.
出处
《印制电路信息》
2004年第2期12-18,共7页
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