高厚径比、高可靠性背板的孔制备与金属化

Hole Preparation and Metalization of High Aspect Ratio,High Reliability Back Panels

构成“电镀工艺”领域的“最好的实践”的任何加工设备必将在质量、生产率和降低成本方面获得重大的进展,本文就是一个起点。

Any fabrication facility that institutes best practicesin the plating process areas will see significantimprovements in quality,productivity,and cost reduction.This article is a starting point.