摘要
本文通过对有机预焊剂的性能及工艺条件的研究,在不同的工艺条件下制作了大量的实验样板,通过对实验板的耐热性及耐湿热性的测试,得出了不同工艺条件下的上锡率。
Based on the research of the character and technology of OSP(organic solderability preservation),plenty of samples made in various process conditions, and their results of hot temperature tests and humidity tests, thepresent method outlines the solderabilities in kinds of process conditions.
出处
《印制电路信息》
2004年第2期55-57,65,共4页
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