Cu互连工艺中Ta基扩散阻挡层的二次离子质谱剖析

With the development of deep submicron integrated circuits (IC), copper metallization has been a replacement for conventional aluminum metallization in high density IC manufacture. But Cu is quite mobile in Si and has poor adhesion to Si or SiO2, which could degrade the performance of copper interconnect. Therefore, a diffusion barrier layer between copper interconnect and Si device is necessary. In this paper, Ta-based barrier layers are deposited on Si substrate with deposition technology of magnetron sputtering. The depth profile of copper interconnect and Ta-diffusion barrier layer are investigated by second ion mass spectrometry(SIMS).