聚苯乙烯塑料表面化学镀镍的研究

Study on the Electroless Nickel Plating on Polystyrene Plastics

对聚苯乙烯塑料表面化学镀镍中的表面改性以及化学镀镍中各种工艺因素对化学镀镍速度以及金属镀层导电性的影响进行了探索性研究。电子能谱研究表明,利用硫酸和重铬酸钾进行表面改性,显著提高了聚苯乙烯表面含氧基团的数量。研究结果表明,随着温度升高,化学镀镍的速度提高,而且镀层的导电性也随之提高,比较理想的化学镀镍温度在80℃左右。稳定剂能提高化学镀镍的均匀性,但对化学镀镍的速度有明显的抑制作用,当稳定剂浓度超过8mg/L时,化学镀镍就不能再进行。酸性镀镍的最佳的pH值范围在4.5～5.5之间。

The electroless nickel plating on the surface of polystyrene was studied. Results show that the surface modification is critical to the electroless plating. Using sulfuric acid and potassium dichromate as surface modifier results in the increase of oxygen containing groups on PS surface. Plating rate and conductivity of the deposit depend on the pH value of plating bath, reaction temperature and concentration of stabilizer. The optimum pH falls in the range of 4.5-5.5. Plating rate can reach 3 μm/m at 80°C, pH from 4.5-5.5 and 2-3 mg/L stabilizer.