多层印制电路板翘曲成因与对策

Cause of Multilayer Printed Board’s Warp and the Countermeasure

翘曲是多层板生产中最常见而又最难解决的缺陷。造成多层板翘曲的因素很多而且复杂,但层压工艺因素是导致多层板翘曲的主要因素。本文从多层板层压工艺控制入手,提出了控制或改善多层板翘曲度的方法。

Warging is an ordinary bug in production of multilayer printed board, and it’s very difficult to settle. There are a good many factor cause multilayer printed board warg. But the main factor is laminating technology. This article provide an method to control and improve warpage of multilayer printed board by control laminating technol- ogy.