摘要
为了精确检测硅片表面的纳米级翘曲特征 ,使用泰曼 -格林干涉仪与图象处理技术相结合 ,采用五步相移算法 ,将检测的精度提高到λ/ 2 0 ,达到纳米级。本文对这种方法进行了理论分析和实验验证。
In order to measure nano-flexure of silicon waf er s or chips,digital image was intergrated with Twyman-Green interferometer,and by applying five-frame algorithm in image processing,the measurement precision was improved to nano-scale.The interference theory was given and the demonstrative experiment was conducted successfully.
出处
《机床与液压》
北大核心
2004年第12期181-182,80,共3页
Machine Tool & Hydraulics
基金
MOST Hig hTechnology Program资助
关键词
干涉法
五步相移法
纳米级翘曲
数字图象处理
Interferometry
Five-frame phase-shifting algorit hm
Nano-fleuxre
Digital image manage
