摘要
研究了Cu 11.5%Fe合金经固溶和时效处理后导电性的变化规律。采用SEM和TEM观察了经不同规范热处理Cu 11.5%Fe合金的组织结构,利用XRD测定了铜基体的晶格常数,得出时效处理对合金电阻率的影响规律,并探讨了合金电阻率变化的内在原因。结果表明:影响合金导电性的主要因素是溶质散射电阻、析出应变场散射电阻;固溶处理的合金经过550℃、2h时效处理,可得到较低的电阻率。
The effect of aging treatment on conductivity of Cu-11.5%Fe alloys was studied. The microstructures of Cu-11.5%Fe alloys after different aging treatment were studied by transmission electron microscope (TEM) and scanning electron microscope(SEM). The lattice parameter of Cu matrix was measured by X-ray diffraction (XRD). The effect of aging on resistivity was obtained and the internal reason of resistivity change was discussed. The results show that the resistivity of Cu-Fe alloys are contributed mainly by the Fe impurity scattering and the scattering associated with strain fields of Fe precipitates. Cu-11.5%Fe alloys present favourite conductivity after aging at (550 ℃) for 2 h .
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2004年第11期1912-1917,共6页
The Chinese Journal of Nonferrous Metals
基金
大连科技计划资助项目(2002A1GX024)