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Cu-11.5%Fe合金的导电性 被引量:5

Conductivity of Cu-11.5%Fe alloys
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摘要 研究了Cu 11.5%Fe合金经固溶和时效处理后导电性的变化规律。采用SEM和TEM观察了经不同规范热处理Cu 11.5%Fe合金的组织结构,利用XRD测定了铜基体的晶格常数,得出时效处理对合金电阻率的影响规律,并探讨了合金电阻率变化的内在原因。结果表明:影响合金导电性的主要因素是溶质散射电阻、析出应变场散射电阻;固溶处理的合金经过550℃、2h时效处理,可得到较低的电阻率。 The effect of aging treatment on conductivity of Cu-11.5%Fe alloys was studied. The microstructures of Cu-11.5%Fe alloys after different aging treatment were studied by transmission electron microscope (TEM) and scanning electron microscope(SEM). The lattice parameter of Cu matrix was measured by X-ray diffraction (XRD). The effect of aging on resistivity was obtained and the internal reason of resistivity change was discussed. The results show that the resistivity of Cu-Fe alloys are contributed mainly by the Fe impurity scattering and the scattering associated with strain fields of Fe precipitates. Cu-11.5%Fe alloys present favourite conductivity after aging at (550 ℃) for 2 h .
出处 《中国有色金属学报》 EI CAS CSCD 北大核心 2004年第11期1912-1917,共6页 The Chinese Journal of Nonferrous Metals
基金 大连科技计划资助项目(2002A1GX024)
关键词 Cu-11.5%Fe合金 时效处理 电阻率 Cu-11.5%Fe alloys aging resistivity
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  • 1Biselli C, Morris D G. Microstructure and strength of Cu-Fe in-situ composites after very high drawing strains[J]. Acta Materialia, 1996, 44(2): 493-504.
  • 2Jerman G A, Anderson I E, Verhoeven J D. Strength and electrical conductivity of deformation-processed Cu-15 vol pct Fe alloys produced by powder metallurgy techniques[J]. Metall Trans A, 1993, 24(1): 35-42.
  • 3Bevk J, Harbison J P, Bell J L. Anomalous increase in strength of in-situ formed Cu-Nb multifilamentary composites[J]. J Appl Phys, 1978, 49(12): 6031-6038.
  • 4Verhoeven J D, Chuen S C, Gibson E D. Strength and conductivity of in-situ Cu-Fe alloys[J]. J Mater Sci, 1989, 24(7): 1748-1752.
  • 5Boltax A. Precipitation processes in copper-rich copper-alloys[J]. Trans Met Soc AIME, 1960, 218(4): 812-821.
  • 6Hansen M. Constitution of Binary Alloys[M]. New York: McGraw-Hill, 1958. 580.
  • 7Verhoeven J D, Downing H L, Chumbley L S, et al. The resistivity and microstructure of heavily drawn Cu-Nb alloys[J]. J Appl Phys, 1989, 65(3): 1293-1301.
  • 8Hong S I, Hill M A. Microstructure and conductivity of Cu-Nb microcomposite fabricated by the bundling and drawing process[J]. Scripta Materialia, 2001, 44(10): 2509-2515.
  • 9Heringhaus F, Schneider-Muntau H J, Gottstein G. Analytical modeling of the electrical conductivity of metal matrix composites: application to Ag-Cu and Cu-Nb[J]. Mater Sci Eng, 2003, 347(1-2): 9-20.
  • 10Pelton A R, Laabs F C, Spitzig W A, et al. Microstructural analysis of in-situ Cu-Nb composite wires[J]. Ultramicroscopy, 1987, 22(1): 251-265.

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