摘要
在 2 -甲基咪唑作促进剂和三聚氰胺磷酸盐类树脂 (Nonfla 60 1)作阻燃剂的条件下 ,利用E 5 1环氧树脂与双氰胺发生固化反应生成的树脂胶液 ,制备了阻燃性能比传统的FR 4覆铜板更好的新型无卤化覆铜板。并通过对树脂胶液的配方优化 ,确定了树脂胶液的配比 (质量比 ) :E 5 1/2 -甲基咪唑 /Nonfla 60 1/双氰胺 =10 0 /0 .0 4/2 0 /3 .0 ,新型无卤化覆铜板的成本比传统FR 4覆铜板降低将近 5 0 %。
A halogen-free and environment-friendly copper cla d laminate was prepared via curing E-51 epoxy resin with dicyandiamide, using 2-methyl iminazole and Nonfla-601 as the accelerating agent and the flame retardant, respectively. It was found that dicyandiamide may increase the peeli ng strength, glass transition temperature, and the thermal stress. The productio n cost of the copper clad laminate was reduced about 50 %. The optimal formulati on was E-51/2-methyl iminazole/Nonfla-601/dicyandiamide=100/0.04/20/3.0(wt%).
出处
《中国塑料》
CAS
CSCD
北大核心
2004年第11期59-62,共4页
China Plastics
基金
湖南省科技攻关重点项目 (0 3SSY40 5 4)
关键词
环氧树脂
固化反应
促进剂
阻燃剂
覆铜板
无卤化
epoxy resin
curing reaction
accelerating agent
fla me retardant
copper clad laminate
halogen-free
