PCB热变形的实时干涉测量研究

Real-time Holographic Interferometry in Thermal Deformation of PCB

采用二次曝光和实时全息干涉技术对某一PCB进行了实验测试,获得了不同功率和不同夹持条件下PCB表面的离面位移分布以及离面位移随时间的动态变化图象。对两种不同的条纹图像进行处理,结果表明,随功率的增大,器件的离面翘曲量增大;在不同夹持条件下,由于器件局部受力约束和热传导条件的差异,呈现不同的位移分布,电阻区(热源区)附近的离面翘曲量变化较快而且较大。

In this paper, double exposure holograms and real-time holographic.Interferometry are applied to test a aviation apparatus.The results show that the out-of-plane displacement distributing and the full-motion video-images of the out-of-plane displacement under different power and fixing conditions, through deposing the two different pattern stripe, The results show that the out-of-plane displacement of PCB increase with the power increasing and the out-of-plane displacement distributing is different under the different fixing conditions and the conduction and restriction, the out-of-plane displacement in district of resistance vary quickly and largely.