氮化铝与无氧铜低温界面热阻的实验研究

EXPERIMENTAL INVESTIGATION ON THERMAL CONTACT RESISTANCE OF AlN AND OFHC-Cu CONTACT AT LOW TEMPERATURE

用低温真空实验装置稳态导热法,实验研究了界面温度和接触压力对氮化铝(AlN)与无氧铜(OFHC Cu)间接触界面热阻的影响。在实验温度(90～210K)和压力(0.273～0.985MPa)范围内,AlN/OFHC Cu界面热阻随接触压力的提高而降低,而当界面温度上升时界面热阻由于热载子热运动的强化而降低,温度较高时,界面热阻随压力变化的速率较大。

The influence of interfacial temperature and contact pressure on thermal interfacial resistance is experimentally studied by one-dimensional steady state heat conduction. In range of temperature(90～210 K) and contact pressure (0.273～0.985 MPa), thermal contact resistance of AlN/OFHC-Cu decrease with a increasing contact pressure, and with a increasing contact temperature by the intensive movement of heat carrier. When the temperature of interface is higher , the change rate of thermal contact resistance as contact pressure become more swift.