摘要
简要阐述了便携式电子产品在制造中采用的几种封装技术,即;倒装芯片、MCM、WLP等,及对其利弊进行了分析,并对技术现状进行了简要说明。
New technologies and processes has been put into the market as bamboo shoots after a spring rain with the widely application of portable electronics products. This paper briefly describes the several packaging technologies (including flip chip, MCM,WLP and so on) used in manufacturing of portable electronics products and analysis their advantageous and disadvantagous as well as mainly prescribes the states of the technologies.
出处
《电子工业专用设备》
2004年第12期32-36,共5页
Equipment for Electronic Products Manufacturing
